VR
  • <p><strong>1. Cutting</strong>​​​​​​​</p>

    1. Cutting​​​​​​​

    The copper clad plate raw materials, cut into the size we need, called opening.The process of cutting is to improve the utilization rate of raw materials and reduce the price of veneer.

    11

  • <p><strong>2. Pretreatment</strong>​​​​​​​<br></p>

    2. Pretreatment​​​​​​​

    Remove the pollutants on the copper surface and increase the roughness of the copper surface to facilitate the subsequent film pressing process.

  • <p><strong>3. Lamination</strong>​​​​​​​<br></p>

    3. Lamination​​​​​​​

    The copper surface of the treated substrate is pasted with corrosion resistant dry film by hot pressing.

  • <p><strong>4. Exposure</strong>​​​​​​​<br></p>

    4. Exposure​​​​​​​

    The transfer of an image from the original film to a photographic substrate by the action of passing light.

  • <p><strong>5. Developing</strong>​​​​​​​<br></p>

    5. Developing​​​​​​​

    The dry film without chemical reaction is washed away by lye action, and the dry film of reaction is left on the surface as a protective layer against etching.

  • <p><strong>6. Etching</strong>​​​​​​​<br></p>

    6. Etching​​​​​​​

    The copper exposed after development is etched away with the use of liquid medicine to form the inner line graphics.The copper exposed after development is etched away with the use of liquid medicine to form the inner line graphics.

  • <p><strong>7. Remove the film</strong>​​​​​​​<br></p>

    7. Remove the film​​​​​​​

    Strong alkali is used to peel off the corrosion resistant layer protecting the copper surface and expose the circuit pattern.

  • <p><strong>8. Punching</strong>​​​​​​​<br></p>

    8. Punching​​​​​​​

    CCD is used to flush out the positioning hole and rivet hole.


  • <p><strong>9. AOI inspection</strong>​​​​​​​<br></p>

    9. AOI inspection​​​​​​​

    By automatic optical inspection, compare with sample or original data to find defects.

  • <p><strong>10. Drilling</strong>​​​​​​​<br></p>

    10. Drilling​​​​​​​

    A conductive hole is drilled on the PCB board surface for the line connection between layers.

  • <p><strong>11. Heavy copper</strong>​​​​​​​<br></p>

    11. Heavy copper​​​​​​​

    Remove burrs at the edges of holes to prevent poor plating.


  • <p><strong>13. Resistance welding</strong>​​​​​​​<br></p>

    13. Resistance welding​​​​​​​

    The parts that need to be welded on the PCB board are reserved, and other circuits and copper surfaces are covered to improve the electrical performance.

  • <p><strong>14. Screen printing</strong>​​​​​​​<br></p>

    14. Screen printing​​​​​​​

    Convenient circuit maintenance and installation, logo and word code for annotation.

  • <p><strong>15. Surface treatment</strong>​​​​​​​<br></p>

    15. Surface treatment​​​​​​​

    PCB board surface treatment for better welding reliability, thermal stability, surface smoothness.

  • <p><strong>16. V - CUT</strong>​​​​​​​<br></p>

    16. V - CUT​​​​​​​

    It is convenient and smooth to cut the original board into a single board process.

  • <p><strong>17. Test</strong>​​​​​​​<br></p>

    17. Test​​​​​​​

    Perform bare board test on electrical performance of PCB board to meet customer requirements.




18. Packing

Vacuum packing first, then safety packing


PCB  Capacity

PCB fast samples

We are extremely good at providing customers with the shortest 24 hours of rapid circuit board proofing service.When your company needs fast circuit board proofing, you just need to send the documents to us, you can receive high quality circuit board in a very short time, and have a very attractive price competitiveness. In addition, we will also reflect the design problems found in your PCB sample making process in the trial production report.


All DFM manufacturability checks and process problem finding reports are free of charge. Many PCB rapid proofing companies in the market put more than a dozen boards together for material opening production, which will lead to many quality risks. However, we only produce proofing for each type of PCB separately to ensure quality and reduce the accuracy of PCB circuit simulation verification.

PCB multilayer board and complex process

Support 1 to 48 layers of multi-layer plate, HDI, blind hole, BGA, disc hole, gold finger, resin plug hole, laser drilling, 3mIL line width line spacing and other complex processes.

Prototyping PCB Technologies

We can offer nearly limitless capabilities for our prototyping PCB services.


Whether our customers need single or double-sided FR4 pcb boards or very high technology blind and buried via boards, boards made with unique materials, China Dragon will be able to bridge your design concept with reality.


Our capabilities span a number of advanced technologies including thermal PCBs, microwave PCBs, heavy copper, rigid-flex PCBs,  flex PCBs and MCPCB.

We have the capabilities to supply prototype boards for advanced industries and critical system designs, including:

* Aerospace
* Automotive
* High Performance Computing (HPC)
* Industrial
* Medical
* Military / Defense

Advanced IPC standards are also adhered to, depending on technology

Our engineering staff is available to consult you throughout the layout, build, and testing phases of prototype manufacturing, moving your application through additional prototyping stages or into production.


When you have finalized your design and the application of your prototype PCBs, we are also capable of a full production run for your product/application, including full turnkey assembly, with tighter PCB tolerances.


Moving a prototype into production with us will also give you the benefit of no additional tooling fees.

Testing Protocol

All of our prototype PCBs include standard fabrication tests and inspections:
* DFM testing & analysis
* Design & BOM validation
* Standard electrical validation test (EVT) via flying probe
A visual inspection is performed for PCB assembly.
Additional advanced testing can be requested, but will affect turnaround lead times.
View our entire PCB testing capabilities.

These standard tests will detect and assist with diagnosing many common issues, including:

* Design Flaws* Schematic Problems
* Circuitry Issues
* Component Shortages


PCB Prototypes vs. Production Capabilities


SpecificationsPCB Prototype CapabilitiesStandard / Production PCB
Around
Number of Layers1 - 16 layersUp to 48 layers
Min. Order Quantity1 PanelN / A
Turn Around Time24 hours up to 6 Layers3 to 21 Days
3 - 7 days for 6-16 Layers
Board MaterialsRigid PCB MaterialsRigid PCB Materials
FR4FR4
FR406FR406
370HR370HR
VT-47VT-47
FR408FR408
ArlonArlon
CEMCEM
Megtron 6Megtron 6
Astra MT77Astra MT77
Tachyon 100GTachyon 100G
Nelco 4000Nelco 4000
Rogers 3000 SeriesRogers 3000 Series
Rogers 4000 SeriesRogers 4000 Series
Rogers 5000 SeriesRogers 5000 Series
Rogers 6000 SeriesRogers 6000 Series
Taconic TLYTaconic TLY
PolyimidePolyimide

MCPCB, Aluminum Core & Copper Core MaterialsMCPCB, Aluminum Core & Copper Core Materials
Aluminum CoreAluminum Core
Copper CoreCopper Core
Ventec VT-4A1/VT-4A2Ventec VT-4A1/VT-4A2
Aismalibar FasthermAismalibar Fastherm
Aismalibar FlexthermAismalibar Flextherm

Flex PCB MaterialsFlex PCB Materials
KaptonKapton
Shin-Etsu - EpoxyShin-Etsu - Epoxy
Adhesive SystemAdhesive System
Rogers - EpoxyRogers - Epoxy
Adhesive SystemAdhesive System
Dupont FR - FR AcrylicDupont FR - FR Acrylic
Adhesive SystemAdhesive System
Dupont LF - LF AcrylicDupont LF - LF Acrylic
Adhesive SystemAdhesive System
Adhesiveless Base MaterialsAdhesiveless Base Materials
Board Sizes16" x 22"16" x 22"
12" x 21"12" x 21"
22" x 28"22" x 28"
10" x 16"10" x 16"
16" x 22"16" x 22"
12" x 21"12" x 21"
Board Thickness2 layer - 0.010"2 layer - 0.010"
4 layer - 0.020"4 layer - 0.020"
6 layer - 0.020"6 layer - 0.020"

8 layer - 0.062"8 layer - 0.062"
10 layer - 0.062"10 layer - 0.062"
12 layer - 0.062"12 layer - 0.062"


2 layer - 0.005"2 layer - 0.005"
4 layer - 0.010"4 layer - 0.010"
6 layer - 0.031"6 layer - 0.031"
8 layer - 0.040"8 layer - 0.040"
Copper Thickness0.5 oz - 3 oz4 oz - 10 oz
Hole Aspect Ratio7:0115:01
Minimum Hole Size0.008"
Minimum Trace/Space0.006"/0.006"0.002"/0.002"
Minimum Drill-to-Copper0.010"0.005"
Minimum Pitch1 mm0.3 mm
Final FinishHASL (Solder)HASL
Lead Free SolderGold (ENIG/Hard/Soft)
CopperSelective Gold
GoldImmersion Silver
ENIGOSP
Gold FingersWhite Tin
White TinENEPIG
OSP
ENEPIG
Additional FeaturesPlated SlotsPlated Edges
Non-plated SlotsPlated Milling
Controlled DielectricPlated Counter Bores & Counter Sinks
Covered ViasEdge Castellation
Counter SinksControlled Impedance
Counter BoresSilver Filled Vias
Dual Access FlexNon-Conductive Filled Vias
Suspended Leads


Quality StandardsIPC 6012 Class 2Milspec 31032
Electrical TestingMilspec 55110
100% Netlist TestingMilspec 50884
TDR TestingIPC 6012 Class 3


How to get our PCB quotation ?


Thanks for reviewing China Dragon PCB capabilities, You can fill in the PCB inquiry form online, or send the PCB Gerber files,pcb, .pcbdoc or .cam file  to us by email, When we get your RFQ ,We will reply you within 1 hour.


Send your inquiry

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